Presentation / Installation


Transtiff: Haptic Interaction With a Stick Interface With Various Stiffness
SessionEmerging Technologies
DescriptionWe propose Transtiff, a stick-shaped device that can display various stiffness for stick-based haptic interaction.
Contributors
Ayumu Ogura
Aoyama Gakuin University
Kodai Ito
Aoyama Gakuin University
Shigeo Yoshida
OMRON SINIC X Corporation
Kazutoshi Tanaka
OMRON SINIC X Corporation
Yuichi Itoh
Aoyama Gakuin University
Event Type
Emerging Technologies
TimeThursday, 10 August 202311am - 3:30pm PDT
LocationWest Building, Rooms 150-153
Session Time & Location
Sunday, 6 August 20231:30pm - 5pm PDTWest Building, Rooms 150-153
Monday, 7 August 202311am - 5pm PDTWest Building, Rooms 150-153
Tuesday, 8 August 202311am - 5pm PDTWest Building, Rooms 150-153
Wednesday, 9 August 202311am - 5pm PDTWest Building, Rooms 150-153
Thursday, 10 August 202311am - 3:30pm PDTWest Building, Rooms 150-153
Interest Areas
Gaming & Interactive
Keywords
Haptics
Virtual Reality
Registration Categories
FC
FCS
E
EFC
EE
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