Presentation / Installation


Dense, Interlocking-free and Scalable Spectral Packing of Generic 3D Objects
SessionFabulous Fabrication: From Knitting to Circuits
DescriptionWe introduce a novel packing algorithm that can pack thousands of complex 3D objects densely and free of interlocking. Our efficient spectral placement algorithm places objects densely. Our disassembly algorithm checks for interlockings and corrects them. We generate and pack a set of challenging benchmarks for future evaluations.
Authors
Qiaodong Cui
Inkbit
Victor Rong
Massachusetts Institute of Technology (MIT)
Desai Chen
Inkbit
Wojciech Matusik
Massachusetts Institute of Technology (MIT)
Inkbit
Event Type
Technical Paper
TimeThursday, 10 August 202310:45am - 10:56am PDT
LocationRoom 515 A
ACM Digital Library Technical Papers pdfs
Session Time & Location
Sunday, 6 August 20236pm - 8:30pm PDTWest Hall B
Thursday, 10 August 202310:45am - 12:15pm PDTRoom 515 A
Interest Areas
Research & Education
Recordings
Livestreamed
Recorded
Keywords
Modeling
Registration Categories
FC
FCS
V
VS
EFC
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